The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Cu/Al joints with large faying surface and high bonding ratio were fabricated with an ultrasound-assisted fluxless brazing method using a Zn-3Al near eutectic filler metal. The microstructure, tensile strength, and corrosion resistance of the joints were investigated in terms of brazing temperature. Results showed that, in the joint brazed at 440 ºC, the filler metal layer showed a refined and dispersed...
In this paper, the bond interface of Al-1 wt.%Si wire bonded on Au/Ni/Cu pad at atmosphere temperature was analyzed by using high resolution transmission electron microscopy. Nano-scale characteristics at bond interface indicated that elemental aluminum diffusing into gold layer was with the feature of step-level periodicity. Due to exceeding solid solubility limit, intermediate Au8Al3 phase penetrated...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.