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The morphologies of Cu6Sn5 grains formed at the interface between Sn-3.5Ag (wt.% unless otherwise specified) and Cu substrates were studied in this work. Reflow experiments were performed for 60 s at peak temperatures of 513 K, 533 K, 543 K, and 553 K. Two morphologies of interfacial Cu6Sn5 grains were observed in wetting reactions: prism type, above 543 K, and scallop type, below 533 K. During aging,...
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