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With the rapid development of electronic packaging product design and manufacture, it is one of most concerned problems that how to provide reliable products to the market. One of the most time-consuming problems in the reliability analysis of microelectronic packaging is the problem of conventional heat and humidity sensitivity analysis. The non hermetic package in the microelectronic packaging is...
Moisture induced failure in plastic encapsulated packages is one most important failure mechanisms in microelectronics. This failure is driven by the mismatch between different material properties, such as CTE, CME (Coefficient of Moisture induced Expansion) caused by moisture absorption in plastic packaging materials. Therefore, it is important to know moisture effects on mechanical properties of...
The use of the non-hermetic material for electronic packaging does raise a potential concern, i.e. moisture induced interfacial delamination and pop corning during reflow. Therefore, it is very important we can correctly model the moisture absorption property. In this study, moisture absorption and desorption properties of three kinds of package materials were investigated. Moisture absorption equilibrium...
One type of polymer EPN1180 is selected for the hygroscopic swelling tests and the sample is made in the thickness of 30mum . Coefficient of thermal expansion is tested by using DMA Q800 and coefficient of moisture expansion is tested by using DMA Q800 jointed with a humidity generator. Three conditions temperature, 50degC, 60degC, and 70degC, and different relative humidity with 20RH% steps are used...
Four types of polymer which were selected are EPN1180 and EPN1180 filled with, 40%, 50%, and 65% fused silica. The moisture absorption is carried out in an adjustable thermal and humidity chamber at different temperature and humidity. The diffusion coefficients at different conditions were obtained through the early stage moisture absorption tests. The moisture absorption was revealed to show the...
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