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This paper presents a W-band 2 2 focal-plane array (FPA) for passive millimeter-wave imaging in a standard 0.18 SiGe BiCMOS process (). The FPA incorporates four Dicke-type receivers representing four imaging pixels. Each receiver employs the direct-conversion architecture consisting of an on-chip slot folded dipole antenna, an...
A fully integrated 96GHz 2×2 focal-plane array (FPA) direct conversion imager in 0.18µm SiGe BiCMOS (fT/ƒmax=200/180GHz) employing four integrated antennas with Dicke switches and LO generation/distribution is presented. The PLL plus tripler achieves a locking range of 92.67–98.2GHz and phase noise of −93dBc/Hz at 96GHz measured at 1MHz offset. The 3.5×3mm2 chip achieves an average responsivity and...
A fully-integrated silicon-based 94-GHz direct-detection imaging receiver with on-chip Dicke switch and baseband circuitry is demonstrated. Fabricated in a 0.18-μm SiGe BiCMOS technology (fT/fMAX = 200 GHz), the receiver chip achieves a peak imager responsivity of 43 MV/W with a 3-dB bandwidth of 26 GHz. A balanced LNA topology with an embedded Dicke switch provides 30-dB gain and enables a temperature...
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