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We developed a new chip-to-wafer 3D integration technology using self-assembly and electrostatic (SAE) bonding. High-throughput multichip self-assembly with a high alignment accuracy within 1 μm was achieved by the SAE bonding technique. Self-assembled known good dies (KGDs) were temporarily bonded on SAE carriers by electrostatic bonding force. We implemented multichip transfer processes twice and...
We proposed a new chip-to-wafer 3D integration technology using hybrid self-assembly and electrostatic temporary bonding. In the hybrid self-assembly-based chip-to-wafer 3D integration (HSA-CtW), liquid surface-tension-driven chip self-assembly is combined with high-speed robotic pick-and-place chip assembly and electrostatic multichip temporary bonding. Hybrid self-assembly can realize high-throughput...
Two key technologies consisting of chip-to-wafer bonding through a non-conductive film (NCF) and wafer-level packaging using compression molding were studied for self-assembly-based 3D integration, especially reconfigured wafer-to-wafer stacking. 4-mm-by-5-mm chips having 20-μm-pitch Cu-SnAg microbumps were successfully bonded to wafers through NCF. The resulting daisy chain obtained from the chip-to-wafer...
An all-digital multiphase DLL is presented that is robust to delay mismatch due to process variation. Each of four 90° phase shift blocks accurately align each phase to 90° delay using its own ring oscillator and locking delay code. Harmonic locking is protected by a ring oscillator and a counter. An area efficient binary to thermometer converter is proposed to diminish the area overhead due to four...
We have introduced a new 3D stacking technology called reconfigured wafer-to-wafer 3D integration using surface tension-powered multichip self-assembly and multichip transfer techniques. Many Si chips were simultaneously self-assembled to a carrier wafer named “reconfigured wafer”. High-precision chip alignment with sub-micron-scale accuracy can be realized by optimizing self-assembly conditions....
The standardized uptake value ratio (SUVR) provides a semi-quantitative index of fibrillar amyloid deposition, a neuropathological feature of Alzheimer' s disease (AD), in Pittsburgh Compound B (PIB) PET studies. As accurately identifying individual probable AD patients and subjects at increased risk for AD is of clinical use, we developed the classification model based on SUVR of several AD-associated...
We have newly proposed heterogeneous multi-chip module integration technologies in which MEMS and LSI chips are mounted on Si or flexible substrates using a self-assembly method. A large numbers of chips were precisely and simultaneously self-assembled and bonded onto the substrates with high alignment accuracy of approximately 400 nm. Thick MEMS and LSI chips with a thickness of more than 100 mum...
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