The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Thermal cycling reliability test and finite element analysis have been conducted for plastic ball grid array assembly with Sn63Pb37 solder. Based on the thermal cycling test results, a two-parameter Weibull distribution model was used to determine the characteristic time to failure of plastic ball grid array assembly. Besides, cross-sectioning and optical microscope examination were utilized to identify...
Intermetallic compounds (IMCs) that grow on the interface between the solder alloy and its bonding pads play a crucial role in the reliability of solder joints. It has been identified that the cracking around the IMC layer is the primary failure mode in lead-free solder joints. Therefore the mechanical behavior of the IMC has attracted great attentions. In this paper, mechanical properties of two...
The effects of the moment, axial force and shear force induced during drop impact on the peeling stress of the solder joints were investigated by a 2-D beam model and a 3-D solid model of board level electronic package. It shows that the peeling stress is dominated by the bending stress and the maximum occurs at the PCB end. Results of the two models indicated that in the solder joint array only a...
The strain rate dependent Johnson-Cook material model and the rate independent elastic-plastic model of lead-free solders were used to investigate influence of strain rate effect on the mechanical behavior of solder joints under drop impact loadings. Failure of the solder joints was predicted and the results were compared with the experimental observations. The strain rate effect of lead-free solders...
Solder joints serve as mechanical, thermal and electrical interconnections between the electronic packages and the printed circuit board (PCB). Fracture of the solder joint is the most common failure mechanism in microsystem packages due to mechanical loads. In order to satisfy the demand for understanding the process of solder joint fracture, there is a need for a validated model, which is simple,...
A 3-D finite element model of board level BGA package was built and the Input-G method was used to analyze dynamic solder joint stress in the package during drop/impact. Boundary condition, bolt effects of the test board and peeling stress mechanism were emphasized in current investigation. Dynamic responses of solder joint in frequency domain and time domain were analyzed to find main mechanism of...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.