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The effects of the moment, axial force and shear force induced during drop impact on the peeling stress of the solder joints were investigated by a 2-D beam model and a 3-D solid model of board level electronic package. It shows that the peeling stress is dominated by the bending stress and the maximum occurs at the PCB end. Results of the two models indicated that in the solder joint array only a...
In this paper, the damage fracture of solder joints in board level electronic package subjected to drop impact loadings was numerically simulated by the finite element method and the cohesive zone model. The solder-Cu pad interface was modeled by cohesive zone elements. The results show that fracture initiates at the edge of the PCB side and the damage of solder joint is affected greatly by the used...
The strain rate dependent Johnson-Cook material model and the rate independent elastic-plastic model of lead-free solders were used to investigate influence of strain rate effect on the mechanical behavior of solder joints under drop impact loadings. Failure of the solder joints was predicted and the results were compared with the experimental observations. The strain rate effect of lead-free solders...
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