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Low temperature soldering can reduce the thermal damage which is caused by thermal expansion mismatch among various materials in an electronic package. Eutectic Sn58Bi solder is a promising low temperature lead-free solder due to its lower melting temperature. The effects of Ag and Cu additions on melting characteristics, wettability and microstructures of Sn58Bi lead-free solder were investigated...
In this paper, the Bi-11Ag solders with additions of 1wt.%, 3wt.%, and 5wt.% Sn are prepared to investigate the microstructure, melting characteristic, and tensile strength of the solder joint. The result shows that the melting temperature decreases to 154 °C as the Sn continuously added; the microstructure was refined when the addition of Sn was below 5wt.%, as it reach 5wt.% or more, the dendritic...
Drag reduction of liquid flows on solid/liquid interface has become an important issue with the development of microfluidics systems. Theoretical and experimental studies have shown that at the solid-liquid interface the presence of nanobubbles is believed to be responsible for boundary slip, and the size, quantity and distribution of nanobubbles on hydrophobic surface will influence the slip length...
For the various nano-fluidic based biomedical applications, the study of the drag of fluid flow is of interest. Among which, the study of boundary slip is one of the most important and popular issues. Hydrophobic surfaces, which are believed to have a slip length, play an important role in the fluidic applications. There are various methods to measure slip length on hydrophobic surface. This paper...
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