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For emerging mm-wave consumer applications such as high data-rate wireless communications at 60 GHz and car radar at 76-81 GHz, it is important to investigate the impact of module assembly on IC performance. Flip-chip is a promising candidate to meet requirements like low reflections, low insertion loss and low costs for mm-wave applications. This paper addresses the design, modeling and evaluation...
For emerging mm-wave consumer applications such as high data-rate wireless communications at 60GHz and car radar at 76-81GHz, it is important to investigate the impact of module assembly on IC performance. Flip-chip is a promising candidate to meet requirements like low reflections, low insertion loss and low costs for mm-wave applications. This paper addresses the design, modeling and evaluation...
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