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To explain the very slow growth rate of the CuO scale during copper oxidation at high temperatures above 850°C as reported in the literature, the influence of the morphology of the CuO grains on scale growth was investigated by oxidizing copper with different purities in 0.1MPa oxygen atmosphere at 600–1000°C. Oxidation of 99.99% copper shows that the growth of the CuO scale depends on the morphology...
The effect of impurities on the formation of the inner porous layer in the Cu2O scale during copper oxidation was examined using 99.99 (4N), 99.9999% (6N) and floating-zone-refined (FZR, >99.9999) copper specimens at 800° C. Oxidation for 240 min shows that an inner porous layer was formed in the Cu2O scale near the Cu2O/Cu interface for 4N copper, but not for 6N and FZR copper. The results support...
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