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Wearables that continuously acquire vital and other medically relevant parameters facilitate treatment optimizations for individual patients and reduce the duration of hospitalizations — thus improving the patients' quality of life. To accomplish this, we demonstrate a scalable architecture that connects wearables through a hub to the cloud, combines edge and cloud computing to provide optimal user...
In this paper, we report on a mobile-health intervention study for COPD patients. Mobile devices are used to continuously record relevant patient symptoms, such as lung function, cough intensity, sputum color, vital-signs and activity. Furthermore, behavioral support is provided by a bi-directional communication channel and virtual assistant communication. The goal is to train a predictive algorithm...
This paper deals with the development of a new test stand for determination the thermal conductivity of metals, semiconductors, highly conductive die attaches and substrates using the steady state technique. We designed the test stand and optimized it by FE simulation to have flexibility for the selection of the sample size and measurement parameters. We determine the thermal conductivity from the...
This paper focuses on two-phase flow boiling of refrigerant R134a inside a copper multi-microchannel heat sink for microelectronic central processing unit cooling applications. The heat sink is composed of 100 parallel microchannels, 100 μm wide, 680 μm high, and 15 mm long, with 72-μm-thick fins separating the channels. The base heat flux was varied from 2.57 to 189 W/cm2 and the mass flux from 205...
The following study concentrates on two-phase flow boiling of refrigerant R134a inside two similar copper multi-microchannel heat sinks, one of which was designed for singlephase water cooling of microprocessors. The two-phase heat sink was composed of 100 parallel microchannels, 100 μm wide, 680 μm high, 15 mm long with 72 μm-thick fins, and 63 parallel microchannels. Base heat fluxes and channel-based...
The ongoing need for miniaturization and speed in electronics industry has brought a requirement for better performing thermal management systems. One of the major bottlenecks in thermal management is the thermal interface resistance. Characterisation of thermal interface materials become even tougher a challenge at low bond line thicknesses and higher thermal conductivities of the interface materials...
In view of the rapid increase of microchip power densities, thermal management has become considerably more challenging. This work presents the first results of an effort aimed at developing a liquid-based cooling module capable of handling high heat fluxes. Four modules 20 times 20 times 2 mm3 in size, containing as many as 120 planar ("slot") jets and a drainage channel system that prevented...
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