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This paper deals with the development of a new test stand for determination the thermal conductivity of metals, semiconductors, highly conductive die attaches and substrates using the steady state technique. We designed the test stand and optimized it by FE simulation to have flexibility for the selection of the sample size and measurement parameters. We determine the thermal conductivity from the...
This paper focuses on two-phase flow boiling of refrigerant R134a inside a copper multi-microchannel heat sink for microelectronic central processing unit cooling applications. The heat sink is composed of 100 parallel microchannels, 100 μm wide, 680 μm high, and 15 mm long, with 72-μm-thick fins separating the channels. The base heat flux was varied from 2.57 to 189 W/cm2 and the mass flux from 205...
The following study concentrates on two-phase flow boiling of refrigerant R134a inside two similar copper multi-microchannel heat sinks, one of which was designed for singlephase water cooling of microprocessors. The two-phase heat sink was composed of 100 parallel microchannels, 100 μm wide, 680 μm high, 15 mm long with 72 μm-thick fins, and 63 parallel microchannels. Base heat fluxes and channel-based...
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