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This paper focuses on two-phase flow boiling of refrigerant R134a inside a copper multi-microchannel heat sink for microelectronic central processing unit cooling applications. The heat sink is composed of 100 parallel microchannels, 100 μm wide, 680 μm high, and 15 mm long, with 72-μm-thick fins separating the channels. The base heat flux was varied from 2.57 to 189 W/cm2 and the mass flux from 205...
Integrating microchannels at the thermal interfaces of heat sinks, spreaders, and microprocessor chips can reduce bond line thickness, assembly pressure, and overall thermal resistance. The channels help control the flow of particle-filled thermal interface materials (TIM) during the assembly squeeze but the relationship between channel geometry, material properties, and interfacial area is not fully...
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