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In order to improve the heat dissipation performance of IGBT module, a new type of structure unit for Three-dimensional IGBT module packaging which can implement double-sided cooling has been built. In view of the traditional single-sided cooling structure unit of IGBT module and the new type of Three-dimensional structure unit in double-sided cooling IGBT module, a corresponding mathematical model...
Double-sided cooling IGBT module is a kind of package structure which can increase the power density effectively, improve the reliability in some special circumstance. In view of the special requirements of packaging process for double-sided cooling IGBT module, a mathematical model of the soldering process about the Three-dimensional structure of double-sided cooling IGBT module has been built, and...
Double-sided cooling IGBT module is a kind of package structure which can increase the power density effectively, improve the reliability in some special circumstance. In view of the special requirements of packaging process for double-sided cooling IGBT module, a mathematical model of the soldering process about the Three-dimensional structure of double-sided cooling IGBT module has been built, and...
In order to improve the heat dissipation performance of IGBT module, a new type of structure unit for Three-dimensional IGBT module packaging which can implement double-sided cooling has been built. In view of the traditional single-sided cooling structure unit of IGBT module and the new type of Three-dimensional structure unit in double-sided cooling IGBT module, a corresponding mathematical model...
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