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Warpage issue of the complex structure of fan-out wafer level package was studied and the suitable mechanical model was obtained. By using the model, the warpage in 12-inch wafer can be reduced within 2 mm, both after post mold cure and grinding of molding compound by optimizing the mechanical properties.
In plane collective bonding by NCF-TCB with the film inserted between the die and the substrate, which had a significant potential to enhance the productivity, was studied. PTFE and the newly developed film which consisted of thermosetting resin layer were evaluated as the insertion films. The performance of the bonding force leveling was evaluated. Bonding was carried out by the intentionally inclined...
Die first and face up type FO-PLP preparation was studied referring the organic substrate fabrication process. 660 mm x 515 mm size carrier was used and 640 mm x 495 mm area was encapsulated with the film molding material comparing with granule material. 3 mm x 3mm to 10 mm x 10 mm dies were mounted on the panel using temporary adhesive. Die shift at compression molding was evaluated in each die size...
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