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With the rapid development of the semiconductor filed, more and more challenges have been put forward to the packaging materials as well. Epoxy molding compound (EMC) as one the most important packaging material with the monopoly position was required for low water absorption, high adhesion, and low internal stress and so on. Here, adhesion improvement has been investigated through introducing special...
With the rapid development of the semiconductor filed, more and more challenges have been put forward to the packaging materials as well. Epoxy molding compound (EMC) as one the most important packaging material with the monopoly position was required for low water absorption, high adhesion, and low internal stress and so on. Here, adhesion improvement has been investigated through introducing special...
With the rapid development of the semiconductor filed, more and more advanced package types have turned up such as Quad Flat No-lead (QFN), Ball Grill Array (BGA), and so on to meet the requirement of the high O/I function. Followed on, warpage has emerged as a big challenge during cutting and surface mounting process. As packing material, Epoxy molding compound (EMC) often show different performance...
The delamination of epoxy molding compound (EMC) on T0252 after JEDEC level 3 and 260c reflow was studied from 3 factors as epoxy resin, phenol hardeners, and filler content. It indicated that when the epoxy resin is mixed of biphenyl and EOCN type, phenol resin is the new type with the structure as Fig.l, filler content as 84%, the resulting epoxy molding compound exhibited the same performance as...
Thermal stability and color change of carnauba wax, ester wax, OP wax, S wax, stearic acid, GMS and a few polyethylene wax types were investigated by heating them to a specific temperature 175C for about 50hours. Cluster analysis was adopted by analyzing the weight loss of the wax. Based on the weight loss data, these wax can be divided into three groups, the most stable group which includes carnauba...
Optimal packing of spherical silica fillers used in epoxy molding compound (EMC) field was studied through founding theoretical and experimental models based on Dinger-Funk equation. The former model kept the superposition contentment of calculated particle size distribution (PSD) curve with Dinger-Funk equation distribution curve while the later model ignored the superfine particle distribution area...
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