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The reliability of complex interconnect structures at all levels of the chip integration hierarchy has become a major concern due to the use of fine feature sizes, diverse materials, and complex 3D architectures. Reliability issues range from stress related failures such as dielectric cracking and interface debonding during manufacturing to electrical and mechanical failures such as electromigration...
Two side direction burrs is an important factor of influence to edge quality and performance of precision parts. A finite element model was developed for simulation of two side direction burr formation process. Based on strain distribution, a two side burr formation mechanism was proposed. Strain of Cutting lay material near the side face in two side direction of work piece is determinant factor of...
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