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Thin silicon (Si) wafers with thickness of 100–140μm were obtained by using a multi-wire slicing process with a SiC slurry. We investigated the process yields of wafer slicing as well as physical/electrical properties of the sliced wafers with various thicknesses. As the wafer thickness decreases, the process yield abruptly decreased due to wafer breakage during the slicing process, and conventional...
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