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A novel approach for the thin film encapsulation (TFE) of organic photo-diode (OPD) for the next generation of organic/inorganic hybrid complementary metal oxide semiconductor (CMOS) image sensor is reported. The TFE is composed of two different metal-oxides stacked in bi-layer thin film architecture. The first layer is composed of aluminum oxide (AlOx) deposited by atomic layer deposition (ALD) at...
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