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WLP has been a gradually adopted by the industry during the last years due to its unique characteristics regarding package size and height, package electrical and thermal characteristics and cost. As one of the earlier formats of this wafer level packaging technology, FIWLP is actually its main version with several WLCSP products in HVM since several years, and being adopted in more and more mobile...
eWLB(embedded Wafer Level Ball Grid Array) is a fan-out wafer level packaging (FO-WLP) technology, its core process is the encapsulation of active and/or passive components in epoxy mold compound (MC) acting as both the physical support of the components and the base of the fan-out area accommodating the second level connections. One eWLB solution is FIMP (Fan-In WLP with Mechanical Protection) technology...
The use of embedded Wafer Level Ball grid array(eWLB)[1] technology for the construction of single and multiple side by side die packages has become widespread since the introduction by Infineon technologies more than five years ago. The flexibility of this packaging to include different die material types such as Si and GaAs combined with excellent mechanical, electrical and thermal performance and...
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