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The present paper relates to a lead-oxide-free copper thick-film paste for printing on ceramic substrates, especially on alumina. Commercialized copper thick-film pastes usually consist of copper powder with lead-oxide glass, which should be avoided in regard to the RoHS Certificate of Conformity. The screen printing technology could be an alternative method instead of the standard DCB process, particularly...
Power electronics devices are generating heat losses up to several hundreds of Watt/cm2. Chip shrinking causes a steady increase of heat to be dissipated. Intelligent solutions must be developed for better heat conduction from the chip to the ambient. The reduction of the thermal resistance of power modules is one of the challenges for the future. Decreasing the thermal resistance of the ceramic by...
The past years saw a marked increase in power density for packaged LEDs and also an increase in requested lifetimes for the same modules. This leads to the need for substrate materials that show an improved thermal conductivity and reliability over standard FR4 or insulated metal substrates. Direct copper bonded (DCB) substrates offer a significantly lower thermal resistance and have already become...
Direct bond copper (DBC) substrates have been proven for many years as an excellent solution for electrical isolation and thermal management of high power semiconductor modules. The advantages of DBC-substrates are high current carrying capability due to thick copper metallization and a thermal expansion close to that of silicon at the copper surface due to high bond strength of copper to ceramic...
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