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Power electronics devices are generating heat losses up to several hundreds of Watt/cm2. Chip shrinking causes a steady increase of heat to be dissipated. Intelligent solutions must be developed for better heat conduction from the chip to the ambient. The reduction of the thermal resistance of power modules is one of the challenges for the future. Decreasing the thermal resistance of the ceramic by...
This paper presents the conception and the experimental procedures of flat copper heat pipe embedded in extremely thin 3D packaging substrates. Since conventional machining for this application is very complicated and expensive, the DBC (Directed Bonded Copper) technology proved to be more interesting for mass production. The experimental results demonstrated that the DBC heat pipe is an excellent...
Direct bond copper (DBC) substrates have been proven for many years as an excellent solution for electrical isolation and thermal management of high power semiconductor modules. The advantages of DBC-substrates are high current carrying capability due to thick copper metallization and a thermal expansion close to that of silicon at the copper surface due to high bond strength of copper to ceramic...
Direct bonded copper substrates have been proven for many years as an excellent solution for electrical isolation and thermal management of high power semiconductor modules. The advantages of DBC substrates are high current carrying capability due to thick copper metallization and a thermal expansion close to the one of silicon at the copper surface due to high bond strength of copper to ceramic....
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