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We report on a novel methodology for fabricating multilayer, high aspect ratio, 3D microfluidic structures with through-layer vias that can be bonded between two hard substrates. It is realized by using a plastic plate embedded PDMS stamp in soft lithography to obtain flat and open PDMS structures that can be stacked to form multiplayer 3D microfluidic networks in high yield without severe structure...
A closed-form expression for via barrel-plate capacitances is derived. This results in a more accurate equivalent circuit model for decoupling capacitors including both parasitic inductances and via capacitances. Multilayer power distribution network (PDN) are then analyzed by incorporating the circuit models of both vias and parallel plane pair. Circuit simulator is used to evaluate the coupling...
The via-plate capacitance for a via transition to a multilayer printed circuit board is evaluated analytically in terms of higher order parallel-plate modes. The Green's function in a bounded coaxial cavity for a concentric magnetic ring current is first derived by introducing reflection coefficients for cylindrical waves at the inner and outer cavity walls. These walls can be perfect electric conductor...
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