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The high level of integration in digital electronic chips based on three-dimensional (3D) technology requires accurate modelling of the vertical interconnects (the through silicon vias – TSVs). An accurate prediction of the signal propagation and crosstalk of the TSVs cannot be based on the single via since the interaction among adjacent TSVs in a high density array cannot be neglected. An algorithm...
This paper looksat the impact of consideringthe exact or approximated values for the nonlinear depletion capacitance in a TSV equivalent circuit for transient analysis. Furthermore, the effects of the time variant and nonlinear behavior of the doped bulk silicon substrate on signal propagation and crosstalk are also studied.
A closed-form expression for via barrel-plate capacitances is derived. This results in a more accurate equivalent circuit model for decoupling capacitors including both parasitic inductances and via capacitances. Multilayer power distribution network (PDN) are then analyzed by incorporating the circuit models of both vias and parallel plane pair. Circuit simulator is used to evaluate the coupling...
We present a method for BAW (bulk acoustic wave) filters computation. This method compares the equivalent impedance of the BUTTERWORTH-VAN DYKE (BVD) model based on an electrical equivalent circuit with the impedance obtained by piezoelectric equations in one dimension for a piezoelectric structure. Using the least squares method, the three elements of the BVD model can be determined as a function...
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