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Signal vias are often used to move a signal from one PCB layer to another. As a result, these vias can penetrate power/ground plane pair and cause noise coupling (crosstalk) between signal and power/ground nets. This paper studies the noise coupling mechanism using a segmentation approach combined with a via capacitance model and a plane-pair cavity model. Noise coupling from signal to power/ground,...
Due to the increase in board density, routing traces on different layers becomes a widely used strategy. Through-hole vias are often used to connect these traces. Those vias that penetrate power/ground plane pairs could cause noise coupling between signal and power/ground nets. At the same time, the need for clean signal transmitted to receivers results in a wide use of differential signals. This...
A closed-form expression for via barrel-plate capacitances is derived. This results in a more accurate equivalent circuit model for decoupling capacitors including both parasitic inductances and via capacitances. Multilayer power distribution network (PDN) are then analyzed by incorporating the circuit models of both vias and parallel plane pair. Circuit simulator is used to evaluate the coupling...
The via-plate capacitance for a via transition to a multilayer printed circuit board is evaluated analytically in terms of higher order parallel-plate modes. The Green's function in a bounded coaxial cavity for a concentric magnetic ring current is first derived by introducing reflection coefficients for cylindrical waves at the inner and outer cavity walls. These walls can be perfect electric conductor...
The investigation of decoupling issues has been extensively treated in the literature in both the frequency and the time domain [1-9]. The two domains describe from different perspectives the same physical phenomenon, being related by a Fourier transform. In this article, well known decoupling issues usually addressed in the frequency domain [1,2] are discussed in the time domain. Moreover, some modeling...
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