The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
This paper mainly studies the influence of loading rate on the shear mechanical properties of BGA solder joints, four kinds of solders (SAC305, SAC0307, SAC0307-0.07La and SAC0307-0.07La-0.05Ce) were prepared by means of experiment. The results show that the shear strength of the solder joints in the single board structure was increased with the increase of shear rate, but the shear strength of high-silver...
In this paper, the model of BGA solder joints were established by the finite element method (FEM). It would reflect the variations of creep stain in solder joints more truly by the cyclic temperature loading. The results are as follows: when the BGA solder joints subjected to cyclic thermal loading, the equivalent creep strain move to the center of solder joints gradually with the increase of the...
With the decrease of the size of lead-free solder joints, the reliability of solder joints is particularly prominent, which is critical to the mechanical behavior of solder joints. While in the actual production process, the stresses for solder joints are often complex. In this paper, the nano-indentation is used to obtain the mechanical behaviors and the step behaviors of Sn3.0Ag0.5Cu and Sn0.3Ag0...
With the size of Lead-free solder joint decreasing, the reliability of solder joint is particularly prominent, which the mechanical properties of solder joint are critical to its reliability. Meso-mechanical properties and creep behavior of the SAC0307-xCe/Cu micro-solder joints were studied by Berkovich nanoindentation tests with different loading rates at room temperature. The load-depth curves...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.