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The formation and growth of intermetallic compounds (IMC) is a key factor to the reliability of soldering joints in modern electronic mounting and packaging industry. In this paper, by means of Olympus, scanning electron microscope (SEM) and Energy Dispersive X-ray (EDX) analysis methods, the morphology and growth mechanisms of IMCs between SAC305-xNi and Cu joint during soldering as well as aging...
It is gradually recognized that Sn-Ag-Cu is better alloy system for application prospect in the lead-free solders. In order to cut down the cost and improve properties, researchers have always been searching for proper compositions and adding elements to improve properties actively. This paper has investigated the effect of Ni addition on Sn-0.3Ag-0.7Cu (SAC0307) low-Ag solder joint. The results of...
The effects of the fourth Ni element on microstructure and monotonic shear strength of Sn-3.0Ag-0.5Cu lead-free solder were investigated. The addition of the Ni element makes the new (CuxNi1-x)6Sn5 phase, which improves the solder microstructure. The results indicate that the addition of Ni element increases the shear strength of solder joint. When the content of Ni is 0.10 wt.%, the shear strength...
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