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Flip-chip packaging is an integrated circuit packaging technique that uses solder bumps to connect chip with substrate. The underfill process uses epoxy encapsulant to solve this problem and improves the reliability of flip-chip packaging. The encapsulant is filled into the gap between the chip and substrate by the capillary force so that the thermal stresses may disperse into the underfill materials...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.