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Biomarkers discovery research requires the integrated analyses of a variety of the data across multiple domains, including clinical data, pathology data, gene expression, epigenetic data. Proper analysis can help understand the biological mechanism and better interpret the impact of the markers to disease. Realising the nature of the data in biomedical research and translational biomedicine, we developed...
With the increasing stress in working and studying, mental health becomes a major problem in the current social research. Generally, researchers can analyze psychological health states by using social perception behavior. The speech signal is an important research direction in this domain. It objectively assesses the mental health of social groups through the extraction and fusion of speech features...
Based on the existing research of Chinese text clustering, this paper proposes an improved algorithm for the optimization of short term semantic clustering based on social media. The method of weighted factor is introduced to optimize text distance formula and related mathematical proof, the calculation process optimization design from text, written text distance calculation algorithm, the simulation...
This paper proposes a newly distributed reduced order agreement protocols based on the observer to investigate the consensus problem of high-order multi-agent systems with various agents and non-uniform delay of various time and directed communication topology. First, on the basis of Riccati equation, Lyapunov method, as well as Algebraic-Graph theory, a novel algorithm with multistep, is provided...
In this paper, a reconfigurable graphene transmission array is proposed for the generation of vortex radio waves at THz. By perforating the substrate with holes of various diameters, different values of effective permittivity are obtained. The transmission coefficient can be adjusted by changing the chemical potential of graphene. With the excitation of planar wave, the phase-compensation of corresponding...
A very compact ultra-wideband (UWB) multiple-input-multiple-output (MIMO) ground linearly tapered slot Antenna (LTSA) is presented in this paper. On a cost-effective FR4 substrate, it consists of a ground plane and two microstrip feed lines. Its overall dimension is only 22×26 mm2. To miniaturize, two linearly tapered slots on the ground plane, acts as the main radiator. Then it does not need extra...
Penta-graphene (PG) has a large ratio of surface to volume and an intrinsic quasi-direct band gap that may benefit for the application of semiconductor sensors. In order to investigate the adsorption behavior of nitric oxide (NO) molecule on the surface of PG, in this study, the adsorption energy, charge transfer and adsorption distance of NO at different locations of pristine and Al-doped PG are...
In the present study, Sn0.3Ag0.7Cu spherical solders with diameter in the range of 10∼50 µm were assembled on the flux-coated Cu metallization and then reflowed at temperature of 250°C to form Sn0.3Ag0.7Cu/Cu micro-bump joints, and the size and boundary effects on the growth and morphology evolution of interfacial intermetallic compound (IMC) of micro-bump solder joints were studied. Results show...
The formation and propagation of void in flip-chip solder joints would reduce the reliability of solder interconnects obviously. Notably, continuously scaling down of the feature size of solder joints may greatly promote the formation and propagation of void in solder joints under electric current stressing. In addition, the elastic stress field induced by the externally applied stress has a big influence...
Creep deformation and fracture behavior of solder joints with a constant diameter (300 µm) and the decreasing joint thickness (from 300 to 25 µm) under electro-thermo-mechanical coupled loads were characterized using a dynamic mechanical analyzer assembled with a DC power source. The results show that the feature of creep curves of solder joints remains unchanged with the decreasing joint thickness,...
Mechanical properties and strain rate sensitivity of the eutectic Sn-58Bi solder alloy, before and after isothermal aging at 100 °C for 200 h, were investigated. Results show that the grain coarsening occurs in the Sn-58Bi solder alloy with prolonging the isothermal aging time, and the lamellar microstructure of the Sn-58Bi alloy is changed, in which the Bi-rich phase exhibits network-like morphology...
Grain characteristics of copper filler have an important influence on physical properties of through silicon vias (TSVs) in three-dimensional (3D) packaging. Due to the mismatch of coefficients of thermal expansion (CTE) between the copper and silicon, there exist obvious thermal stresses when the TSV structure is bearing thermal load. However, the elastic response characteristics of copper can be...
In this study, core-shell structured SiO2@Ag submicro-sized spheres were prepared and used to improve the performance of the micro-sized silver flakes filled electrically conductive adhesive (ECA). The silica cores with an average diameter of 400 nm were prepared by hydrolysis and polycondensation of tetraethoxysilane using a modified Stöber process. The synthesis of compact silver shells on silica...
Silver nanoparticles stabilized by sodium citrate with an average size of 10 nm were obtained via a modified Carey-Lea method. The synthesized silver nanoparticles were investigated by transmission electron microscope and powder X-ray diffraction. Thermal decomposition and exfoliation of the capping agent from the surface of the nanoparticles were studied by thermogravimetric and differential scanning...
With advantages of non-contact, high energy density and local heating, the laser jet solder ball bonding (SBB) technique provides a flexible packaging method for three dimensional (3D) package structure and temperature sensitive components. In previous works, the microstructure and reliability of solder joints fabricated by laser jet SBB were studied. In recent studies, the essential factors influencing...
To reduce the cost of soldering materials and alleviate the thermal shock of temperature-sensitive electronic components during board-level packaging process, SnBi(Ag) solder pastes were explored to replace SnAgCu solder pastes due to the feature of low melting temperature of SnBi(Ag) solders. In this study, Sn3.0Ag0.5Cu (SAC305) solder balls as IC pins were assembled with SnBi(Ag) solder pastes in...
For supporting the applications of GF-3 and GEOSAR satellite projects, which have been approved by Chinese government, a multi surface parameter inversion algorithm using alternative Radarsat-2 polarimetric images is tested and improved in this study. Result shows that, though the algorithm can retrieve vegetation height and water content with relatively good accuracies, soil moisture and surface...
SAR knowledge base system is a comprehensive application platform for typical objects interpretation, which includes the database of microwave scattering models, backscattering measurement data and SAR image. The paper introduces the design of the whole system and gives a detail description for each database in the system. The comprehensive knowledge rules for SAR application is developed based on...
Smartphone-based assessments have been considered a potential solution to passively monitor gait and mobility in early-stage Parkinson's disease (PD) patients. In the Multiple Ascending Dose clinical trial of PRX002/RG7935, 44 PD patients and 35 age-and gender-matched healthy individuals performed smartphone-based assessments for up to 24 weeks and up to 6 weeks respectively. For "passive monitoring",...
Signal strength difference (SSD) is widely utilized as the feature for Wi-Fi fingerprint localization to tackle the heterogeneity between training device and target device, but the correlation between SSDs is largely ignored. In this paper, a novel scheme named LC-KDE is proposed. It utilizes local Fisher discriminant analysis (LFDA) to transform the original SSDs into weakly correlated features,...
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