The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
A simple method to increase the adhesion strength between leadframe and epoxy molding compound (EMC) was reported in this paper. Cone-structured copper film was deposited on copper-based leadframe sheets by electroless plating. SEM observation of the as-prepared film indicates that cone size distinctly depends on plating time. Adhesion strength between EMC and cone-coated leadframe was measured by...
An ideal low temperature bonding method was studied. Cu cones were prepared by electroless plating. Heating and pressure were used in the bonding process between Cu cones and Sn-3.0Ag-0.5Cu solder. It's a solid state bonding method because the bonding process was performed below the melting point of solder. Shear strength was measured by bonding tester. Morphologies of Cu cones, fracture surfaces...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.