The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The rapid progress in miniaturization and integration of semiconductor power devices has made heat dissipation a critical concern in the development of high‐performance semiconductor devices, thereby increasing the demands for the heat transfer efficiency of polymer composites. To address this issue, an efficient three‐dimensional (3D) heat conduction network structure is constructed in the polymer...
Ethylene‐vinyl acetate copolymer (EVA) has been widely used for packaging materials for decades. However, EVA was highly restricted due to the poor thermal stability and anti‐static performance. For enhancing thermal stability and anti‐static performances, a large number of additives were added to EVA, which seriously prejudice the processability and mechanical properties of the polymer. To address...