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Ni/diamond dicing blades is the main tool for scribe of silicon wafer at present. In order to decrease the width of dicing slot on the wafer, it is necessary to reduce the thickness of blades, and to increase the hardness, toughness and wear resistance of the Ni/diamond composite coatings in the process of electrodeposition. In this paper, 1,4-bis(2-hydroxyethoxy)-2-butyne (BEO) was used as an organic...
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