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Finite element method is utilized to solve the diffusion equation and model the diffusion driven growth of a pre-existing spherical gas bubble in molten tin at the solder/substrate interface for reflow time of 120 s and temperature of 250 °C. The gibbs free energy change required for determining the equilibrium concentration at liquid solder/gas bubble boundary was calculated using the thermodynamic...
With the advent of lead-free soldering electronic packaging industry, there are growing concerns regarding the problems of voids in lead-free solder joints. Many researchers are eager to understand the growth, evolution and control factors of bubbles. Due to the restrictions in test conditions imposed by high temperature and opacity of soldering, one cannot directly observe and analyze the behaviour...
Interfacial intermetallic compound (IMC) is a necessary condition for the reliability of solder connection. In this study, the fiber lasers were used to solder rapidly-solidified lead-free solder Sn3.5Ag0.7Cu and Cu substrate, investigating the influence of laser soldering process parameters on the growth of IMC at the solid/liquid interface and finding the optimum parameters of laser soldering process...
As soldering process is a high temperature phenomenon accompanied by surface reaction kinetics, the computational model for solder bubble growth can be a strong arena for describing those aspects which are otherwise difficult to be understood through the experimental methods. In this paper, the growth of gaseous bubbles in the molten tin solder has been modeled using finite element method. The advection-diffusion...
The appearance of IMCs on the Sn/Cu interface plays an important role in the joint reliability. Their growth behavior during solidification of multiple reflows was investigated. Compressed air was employed to blow away the residual liquid solder immediately after heating preservation so that the morphology corresponding to heating preservation would remain unaltered; and then by compared they with...
As soldering process is a high temperature phenomenon accompanied by surface reaction kinetics, the computational model for solder bubble growth can be a strong arena for describing those aspects which are otherwise difficult to be understood through the experimental methods. In this paper, the growth of gaseous bubbles in the molten tin solder has been modeled using finite element method. The advection-diffusion...
With the advent of lead-free soldering electronic packaging industry, there are growing concerns regarding the problems of voids in lead-free solder joints. Many researchers are eager to understand the growth, evolution and control factors of bubbles. Due to the restrictions in test conditions imposed by high temperature and opacity of soldering, one cannot directly observe and analyze the behaviour...
Interfacial intermetallic compound (IMC) is a necessary condition for the reliability of solder connection. In this study, the fiber lasers were used to solder rapidly-solidified lead-free solder Sn3.5Ag0.7Cu and Cu substrate, investigating the influence of laser soldering process parameters on the growth of IMC at the solid/liquid interface and finding the optimum parameters of laser soldering process...
The appearance of IMCs on the Sn/Cu interface plays an important role in the joint reliability. Their growth behavior during solidification of multiple reflows was investigated. Compressed air was employed to blow away the residual liquid solder immediately after heating preservation so that the morphology corresponding to heating preservation would remain unaltered; and then by compared they with...
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