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A high gain D‐band hybrid integrated on‐chip antenna (OCA) based on a low‐cost printed circuit board (PCB) packaging technology is analyzed and designed in a standard 40‐nm CMOS process in this paper. The proposed OCA is a hybrid structure of a slotted patch OCA with off‐chip PCB ground and off‐chip dielectric resonator (DR). The proposed OCA exhibits a simulated gain of 3.5 dBi and 53% radiation...