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O2 plasma treatment was performed on the JSR THB-430N negative UV photoresist to modify the surface wettability for micro-bumps electrodepositing. Wettability of photoresist was enhanced after O2 plasma treatment. The samples were placed for different time at room temperature. Micro-FTIR indicated that the hydroxyl groups were introduced on the surface of photoresist after O2 plasma surface treatment,...
The rapid development of three dimensional packaging makes it necessary to develop smaller and more reliable microbumps. In the electrodeposition process of bump cylinder, the filling quality is largely determined by the combination of additives. In this work, the effect and competitive adsorption between suppressor polyethylene glycol (PEG) and accelerator Bis-(3-sodiumsulfopropyl disulfide) (SPS)...
Through silicon via (TSV) technology offers a promising approach to achieve three dimensional integrated circuit integration. Via-last TSV process has the advantages of flexibility and lower cost. In this paper, we report our latest progress on wafer level packaging by via-last process. The 200mm device wafer was bonded with a carrier wafer. Then, the vertical TSV structure with aspect ratio of 3∶1...
Through silicon via (TSV) is regarded as one of the most advanced packaging technologies, however, many serious reliability issues need to be paid more concerns. The Cu pumping effect is one of the most crucial reliability problems. Due to different coefficient of thermal expansion for different packaging materials, Cu-TSV can deform and damage the wiring redistribution layers and degrade the reliability...
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