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With the decrease of the digital circuit noise tolerance and the timing margins tolerance. The simultaneous switching noise (SSN) of Power ground plane become a major bottleneck for high speed design. The existing method of suppressing SSN exist their short comings. In this paper, the new method combined electromagnetic band gap(EBG)with decoupling capacitors is put forwarded to use design to suppress...
With the trend development of the high speed electronic circuits and miniaturization, The simultaneous switching noise (SSN) of power /ground plane become a major bottleneck for high speed design. The existing method of suppressing SSN has their shortcomings. Based on the equivalent circuit analysis for classic electromagnetic band gap (EBG) structure, the new structure in improving the bandwidth...
Novel two-dimensional EBG is put forward to suppress the simultaneous switching noise of electronic systems, Based on the inductance enhanced by the long-line metal between adjacent unit cell, the novel two-dimensional EBG structure is achieved by the units lattice structure, which is made of the connection of a square metal and two metal serpentine lines. Simulation results show that the stopband...
3D integration technology, especially TSV (Through Silicon Via) based 3D package is a feasible solution for high density and high performance system. The TSV provides a vertical interconnection with a much shorter electrical delay between dies. The EMI (Electromagnetic Interfere) issue draws great attention due to the short vertical distance between noise source circuit and sensitive circuit. In this...
This paper describes a parallel test method based on a cross-point switch which can be programmed to control signal path and the number of switches to be opened according to the number of channels to be tested. In this method, at the transmitting side, one source inputted cross-point switch can be fan-out to multi sources to activate device under test, and different signal trace or length of cables...
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