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0.35mm fine pitch wafer level chip scale package (WLCSP) has been developed by NCAP for portable electronic applications. It can provide 196 pin counts in 5mm × 5mm package body size. This paper reports the development work of WLCSP and the package level and board level reliability study including thermal cycling and drop test. The technology is evaluated using a 5mm × 5mm test vehicle with 0.35mm...
The reliability problem and the thermal management problem of active embedded component into organic substrate becomes a bottleneck restricting development. On the one hand, these paper overviews the thermal management features of the technology, the modeling of the thermal management and the application of thermal methods. It does the cooling and the thermal stress simulation analysis for typical...
As electronic products tend to higher density and higher power, thermal management plays a key role in electronic package design, especially in CPU, ASIC and System-in-Package (SiP). The root cause of many product failures can be traced back to heat management, so reducing chip working temperature and improving device thermal performance are necessary requirements. We report on the design and implementation...
In this paper several heat dissipation mechanisms are studied in an effort to improve heat dissipation of a high-power packaged chip in its environment. Specifically we examine a cavity-down structure consisting of a copper plate in thermal contact with the back side of the chip. In order to evaluate the thermal performance of the cavity-down approach, three structures are compared via simulation...
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