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The demand of electronic device applications for high performance, minimization and cost effectiveness has driven the highly integrated semiconductor packaging development in recent years. Embedding die technology, which reduces package height and weight, increases the functionality and density, improves electrical and thermal performance and reduces the cost effectively, is particularly attractive...
With the continuous improvement of system integration, 3-D packages are becoming effective solutions for lighter, thinner, shorter, and smaller electronic products. Meanwhile, packaging engineers are faced with serious signal integrity challenges. Especially significant intrasystem electromagnetic interference (EMI) problems are aggravated for shortened distance between noise sources and sensitive...
The mania for mobility applications such as smart-phones, tablet PCs, and personal computers is sweeping all over the globe. In order to insure the performance of a new product, the Design for Manufacture (DFM) plays an important role on a package design both in research stage and mass product stage. The substrate process capabilities, assembly process capabilities, material properties, and package...
In this study, a 3D package module based on flexible substrate is proposed. In order to improve the thermo-mechanical reliability of the 3D package module, the simulation of the key manufacture process is more and more important. The key manufacture processes of the 3D substrate package module mainly include 2D chip assembly, under-filling, 3D substrate folding, die-attaching, molding, and ball grid...
The absorption behavior of Ag3Sn particles on the surface of intermetallic compounds (IMCs) formed at Sn-3.5Ag-xCu/Cu (x=0, 0.7, 1.5 wt. %) interfaces was studied. The Sn-3.5Ag-xCu/Cu solder joints were prepared by reflow soldering at 260degC for different time. The X-ray diffraction results showed that the dominant IMCs formed at Sn-3.5Ag-xCu/Cu interfaces were Cu6Sn5. For Sn-3.5Ag/Cu and Sn-3.5Ag-0...
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