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In this article, we explore the mechanical properties analysis of polyimide insulators for inkjet printing process, while we analyze the mechanical properties of four layer and four channel power management PCB model that the insulating layers are made of polyimide insulators. Firstly, we extract the shear modulus of specific polyimide insulators by Material Studio software. According to PCB deformation...
This paper put forward a equivalent approach of high-density PCB assembly model, then use of sub-model on the local position of a second analytical solution. Firstly, the equivalent model, fine model and sub-model was established, and then modal analysis, random vibration analysis and sub-model analysis are performed. Comparison with the result data of the three models, it is verified the feasibility...
Aiming at solder ball diameter, solder ball height, solder ball distance and welding plate thickness these four factors of Lead-free solder ball in plastic micro ball grid array devices, this paper uses the analysis method of the combination of the finite element analogy and response method, to analysis thermal fatigue life of lead-free solder ball in plastic micro ball grid array device. Based on...
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