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In this article, we explore the mechanical properties analysis of polyimide insulators for inkjet printing process, while we analyze the mechanical properties of four layer and four channel power management PCB model that the insulating layers are made of polyimide insulators. Firstly, we extract the shear modulus of specific polyimide insulators by Material Studio software. According to PCB deformation...
The gray image of the SMT solder joint usually contain specular highlight component, which is a serious obstacle for reconstructing the three-dimensional shape from SMT solder joint based on shape from shading (SFS) theory. Thus, a highlight processing method for the gray image of SMT solder joint is presented. This method consists of two parts. One is highlights detection to gray images. It is based...
Gold stud bump process provides a good solution for high-power LED's package, which can meet many requirements that the existing methods cannot achieve. To begin with, it is 100% lead-free packaging. Then, it can ensure LED's junction temperature. Next, it can run in pulse, high power or continuous condition. In the end, it is compatible with SMT, and it can bear the reflow temperature three times...
This paper put forward a equivalent approach of high-density PCB assembly model, then use of sub-model on the local position of a second analytical solution. Firstly, the equivalent model, fine model and sub-model was established, and then modal analysis, random vibration analysis and sub-model analysis are performed. Comparison with the result data of the three models, it is verified the feasibility...
The quality of solder joint has a direct effect on the reliability of products, while the detection of solder joint defects plays an important part in the inspection of solder joint quality. So scientific methods should be selected to achieve the intelligent detection of solder joint defects. In this paper, a forward neural network with BP learning algorithm is introduced according to the relationship...
Aiming at solder ball diameter, solder ball height, solder ball distance and welding plate thickness these four factors of Lead-free solder ball in plastic micro ball grid array devices, this paper uses the analysis method of the combination of the finite element analogy and response method, to analysis thermal fatigue life of lead-free solder ball in plastic micro ball grid array device. Based on...
In this paper, we present an approach to recognizing characters in surface mount technology (SMT) product. The recognition rate of SMT product character is not very good, because of unexpected noise in SMT the product character image. An improved SMT product character recognition method is proposed which can improve the recognition rate. At first, the character image is changed into a gray image....
SMT product assembly quality management system structure and content is designed, according to its characteristics and requirements. A developing method of SMT product assembly quality management system is proposed based on J2EE, in order to improve its reusability, portability and expansibility. An integrated architecture which consists of Struts, Spring and Ibatis is designed based on lightweight...
Fast routing is one of the bottlenecks affecting the fast manufacturing of electronic equipments. The three-dimensional auto-routing system ( 3DRS) of electronic equipment is designed on the of unigraphics ( UG ) which is a three-dimensional(3D) modelling software. 3D weighed grid is applied to mesh the 3D routing space of electronic equipment, the labyrinth algorithm based on grid is used to search...
Currently, the Preliminary Pervasive computing environment, such as the intelligent house, the intelligent classroom, the intelligent office, has been realized. However, the intelligent factory based on the Pervasive computing technology is rare. Some people suggest that the wireless sensor networks can be used. But it is complex to deploy it. This paper intends to build the slightly coarse pervasive...
Four micro-acceleration switches, which have different support beams layout, were designed; four finite element analysis (FMA) models of these micro-acceleration switches were set up. By using the FEA models, the modal analysis and the harmonic response analysis of the micro-acceleration switches were performed. The first 6 order natural frequencies and mode shapes of the four micro-acceleration switcher...
A description of the importance of dynamical alliance of enterprises and the key affecting factors on the selection of suppliers for them are given in this paper. The advantage and disadvantage of AHP is introduced in this paper. A new kind of AHP is presented in this paper, which builds judgment matrix using uncertainly voting group decision making and specially deals with interval number and uncertain...
Agency organization is a bridge of enterprise collaborative manufacturing; small and medium scale enterprise (SME) is the main body of collaborative manufacturing. So it is necessary and urgent to build SME collaborative manufacturing system based on agency organization services. In this paper, based on analysis of characteristics of SME, five layers collaborative manufacturing system including physics...
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