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Wire bonding technology has been used extensively in making electrical connections in microwave module. In microwave module, wire bonding technology is one of the key process, RF consistency, reliability and lifetime of microwave module is influenced directly by quality of wire bonding technology. Factors influencing quality of wire bonding technology in microwave module is studied in the paper. The...
An accurate electro-mechanical impedance (EMI) model for analytical crack detection of a Timoshenko beam is established based on the improved reverberation-ray matrix method via the recursive formulations. The crack is treated as a massless rotational spring. A pair of PZT patches with free ends symmetrically bonded onto the beam is assumed in a state of pure one-dimensional axial motion under an...
An analytical description of the static characterization of a smart beam with surface-bonded piezoelectric transducers is developed in this paper. The uniform elastic beam is actuated by piezoelectric patches and modeled as an Euler-Bernoulli beam. The static analysis of the intelligent beam is then given in detail based on a transfer matrix method. Furthermore, the actuation mechanism of the piezoelectric...
The static response of an intelligent beam with surface-bonded piezoelectric patches is investigated in this paper. Timoshenko beam theory is employed to study the properties of beam-like structures bonded with multiple pairs of PZT patches. Here, only one-dimensional axial deformation of PZT wafers is considered. A shear lag model is adopted to simulate the interfacial bonding between PZT patches...
A modified model combining EMI technique and RMM is proposed to quantitatively correlate crack parameters with piezoelectric signatures for structural health monitoring. The structural members are modeled as Timoshenko beams for flexural motion and as the classical longitudinal rods for axial motion as well as the cracks are treated as massless rotational springs. For a structural member with surface-bonded...
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