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Interfacial intermetallic compound (IMC) is a necessary condition for the reliability of solder connection. In this study, the fiber lasers were used to solder rapidly-solidified lead-free solder Sn3.5Ag0.7Cu and Cu substrate, investigating the influence of laser soldering process parameters on the growth of IMC at the solid/liquid interface and finding the optimum parameters of laser soldering process...
Interfacial intermetallic compound (IMC) is a necessary condition for the reliability of solder connection. In this study, the fiber lasers were used to solder rapidly-solidified lead-free solder Sn3.5Ag0.7Cu and Cu substrate, investigating the influence of laser soldering process parameters on the growth of IMC at the solid/liquid interface and finding the optimum parameters of laser soldering process...
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