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This paper demonstrates the impact of modulation schemes on the power capability of a high-power converter with low pulse ratios. This IGCT converter uses a five-level Neutral-Point-Clamped H-bridge topology. It is concluded that phase-shifted carrier modulators are not attractive for such converters at low pulse ratios due to the poor THD (Total Harmonic Distortion) performance and poor power capability...
This paper presents the design challenges of highpower converters with low pulse-ratios from an industry point of view. Some standard design concepts to improve the power capability, power quality and the dynamic performance of the converter are reviewed. The novelty of this work is that it provides an insight of concepts with extremely low pulse-ratios (e.g. 5 pulses per 180 ° fundamental). A comparative...
Stress in flip-chip (FC) packaging process will have a great effect on the performances and reliability of the packaged devices, especially the mechanical parts. Flip chips with various bump-area-arrays have diverse stress distributions due to temperature loads. Since the top surface of the chip is not exposed to optical observation, the traditional full-field optical measurement techniques are not...
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