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In this work, the photolithography processed nickel (Ni) grids were used to replace indium tin oxide (ITO) as the transparent anode for perovskite solar cells. The results show that the Ni grids have a senior adhesion ability to glass substrates than that of Ag grids, and the obtained device show a comparable short circuit current density (JSC) to that of ITO based device, while the open circuit voltage...
Virtual Network Embedding (VNE) is a key step towards network virtualization. In this paper, we first introduce a new link interference metric for each link to quantify the interference caused by its bandwidth scarcity to accept VN requests, and then an Interference-based VNE (I-VNE) algorithm is proposed. Benefited from the new metric, I-VNE can jointly consider the temporal and spatial topology...
This paper presents the development of an ultra-fast SiC phase-leg module built in modified hybrid structure. Being a three-dimensional (3D) packaging technology, the hybrid structure achieves the same footprint as and similar parasitics to the planar packaging, but requires no double-sided solderability on the bare dice, which is not available on current SiC devices. Compared to its previous generation,...
Seven encapsulants with operating temperature up to 250 are surveyed for possible use in high-temperature high-power planar packages. Processability is assessed by studying the flow fronts and the cured properties of the surveyed materials between paralleled plates. Material B failed in the flow test because it dried out in seconds. Materials A, C, and D failed the curability test because...
This paper presents quantitative measurements of Primary Hepatocyte (rat liver cell) adhesion on polyelectrolyte multilayer (PEM) films. Measurements are implemented through detaching the cell from the film using a developed highly sensitive micro-force sensing tool. Experimental results demonstrate the measured detaching or adhesion forces of cells on polyelectrolyte multilayer films with different...
Seven encapsulants with operating temperature up to 250°C have been surveyed for possible use in high-temperature, high-power planar packages. Processability was assessed by studying the flow fronts and the cured properties of the surveyed materials between paralleled plates. Two encapsulants did not pass the flow test, and another two did not pass the curing test. Material E, F, and G were confirmed...
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