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In this paper, the effect of reflow time on shear property of Sn-9Zn solder bumps was studied. The Sn-9Zn solder bumps were prepared by two step electroplating method. With the increase of reflow time, the shear strength decreased first and then increased. The change of shear strength was closely related to the formation of intermetallic compounds (IMCs). Scanning electron microscope (SEM) and Energy...
The presence of habitat structures (e.g. caves, ledges, branches) has well‐documented ecological effects. However, it remains largely unknown how variation in the morphology of particular habitat structures affects ecological interactions.
Using an algae–cladoceran grazer–larval damselfly food chain as a model in a series of microcosm experiments, we manipulated food‐chain length and the length...
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