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On one hand, with the rapid increase of integrated circuits (ICs) I/O number, the traditional package technique does not meet the need of pioneer development. On the other hand, three-dimensional integrated circuits (3-D ICs) become more and more popular to satisfy the multi-function chip development. One of the best solutions of these needs is the ultra-fine pitch micro-bumps. The micro-bumps can...
In this decade, the Moore's law does not fit the trend of technological improvement any more. In order to keep the increasing rate of device density and I/O numbers, the size of devices shrink rapidly. In this kind of condition, the stack of integrated circuit (IC), which is also called three-dimensional integrated circuits (3-D ICs), is a preferable solution of the next-generation products. There...
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