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Recently, the dimensions of the flip-chip solder bumps reduce to about 20-30 micrometers, also known as "micro-bumps" sandwitched between two Si chips. In such a structure, electromigration and thermomigration behaviors in the micro-bumps are not clear now. In this study, the temperature map distribution of Al traces and Al pads in CoC and C4 structures during current stressing was directly...
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