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The electromigration (EM) of a solder ball under high-current stressing causes it damage and reduces its service life. Previous studies suggest that the EM life of solder can be improved by properly selecting the solder stress property (compressive or tensile) at the corners where the electron current enters and exits, but complete and relevant research on this proposition is absent. In this paper,...
It was suggested that electromigration (EM) life of solder can be improved by proper choice of stress property (compressive or tensile) at the two corners where electron current enter and exit. In this paper, we investigated this problem systematically by experiment and finite element simulation. The experimental results show that, compared with the case of tensile stress, the meantime to failure...
In this paper, failure modes of solder under electromigration were shown, the failure mechanism was usually attributed to tensile stress at cathode and compressive stress at anode. To evaluate the electromigration induced stress in solder, a finite element model was developed basing on the coupling equation of stress-mass diffusion with the aid of user development on the platform of ABAQUS. Simulation...
The through-Silicon-Vias (TSV) is a key component of three dimensional electronic packaging, knowing its stresses is very important for its reliability evaluation. In this paper, we evaluated the stress of TSV during thermal cycling with a micro-infrared photoelasticity system in full field and real time measurement mode, three important findings are reported. First, it was found that electroplating...
Bi-stable functionally graded material (FGM) laminated plates are studied in this paper. Considering the bistablity, the isotropic and anisotropic composite laminate plates are analyzed. The numerical results of different FGM under different loading are compared with homogeneous materials by using continuous graded thickness integration rule of shell element. Then, the bistablity of different rotation...
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