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With the rapid increase of data storage density on computer hard disk drives (HDDs), the operation distance between read/write head and disk surface has fallen to just a few nanometers. Chemical mechanical planarization (CMP) has been selected as the best process to produce high quality surface finish during the manufacturing of Ni–P alloy substrates for HDD applications. Herein we report, for the...
Ruthenium will be integrated into copper interconnects as a barrier layer in the near future. During the chemical mechanical polishing process of the ruthenium barrier layer, copper polishing performance with barrier slurries is crucial to microchips' final performance. This paper mainly studies the synergetic effect of benzotriazole (BTA) and non-ionic surfactant on copper polishing performance using...
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