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We investigated the evaporative cooling performance of a nanoporous membrane based thermal management solution designed for ultra-high heat flux dissipation from high performance integrated circuits. The biporous evaporation device utilizes thermally-connected, mechanically-supported, high capillarity membranes that maximize thin film evaporation and high permeability liquid supply channels that minimize...
We demonstrate a MEMS translational stage that uses electrowetting-on-dielectric (EWOD) as the actuating mechanism. Our EWOD stage is capable of linear translation with resolution of 10 μm over a maximum range of 130 μm and angular deflection of approximately ±1° while eliminating solid-solid contact. The range and resolution can be readily improved via higher base contact angle and lower contact...
We present a high-heat-flux cooling device for advanced thermal management of electronics. The device incorporates nanoporous membranes supported on microchannels to enable thin-film evaporation. The underlying concept takes advantage of the capillary pressure generated by small pores in the membrane, and minimizes the viscous loss by reducing the membrane thickness. The heat transfer and fluid flow...
We report the design, fabrication and modeling of a thin film evaporation device for cooling of high performance electronic systems. The design uses a membrane with pore diameters of ∼100 nm to pump liquid via capillarity to dissipate the high heat fluxes. Viscous losses are minimized by using a thin membrane (∼200 nm) which is supported by a ridge structure that provides liquid supply channels. As...
We report the performance of a novel air-cooled loop heat pipe with a planar condenser and planar evaporator, and the performance improvement expected from a multiple-condenser version of the device. The condensers are developed in a modular design, and the heat pipe is configured to allow the installation of multiple, stacked condensers. An analytical model is developed to predict the scaling of...
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